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Category Archives: Soldering
May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume
Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading
May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?
We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading
Apr27
How EMS fabricate a PCB Assembly?
How EMS (Electronic Manufacturing Services) fabricate a PCB (Printed Circuit Board) Assembly? This article is writing for the people who still not yet really under what is the PCB Assembly. Because WorkingBear found there are many people just come to … Continue reading
Apr23
The benefit to use shielding clips to instead of shielding frame
For most RF (Radio Frequency) devices, the PCB needs a shielding frame or shielding can to reduce the effects of EMI (Electromagnetic Interference). A common design uses a shielding frame that is soldered to the PCB, along with a separate … Continue reading
