Category Archives: Test/Inspection


Oct08
What Can an SPI (Solder Paste Inspection) Machine Really Do?

post on October 8, 2025

SPI stands for Solder Paste Inspection. If we’re talking about the actual inspection equipment, people usually add “machine” after SPI. But in most cases, when you mention SPI in an SMT factory, everyone just assumes you’re talking about the inspection … Continue reading →

Manufacture, Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (4,022)     comment (0)
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Jul24
Understanding ORT: What It Is and How It Differs from REL (Reliability)

post on July 24, 2025

ORT stands for Ongoing Reliability Test, and sometimes it’s written as Ongoing Reliability Testing. ORT is a very important quality control measure in electronics manufacturing. Its purpose is to continuously monitor the reliability of products during mass production, so that … Continue reading →

Quality, Reliability, Test/Inspection     WorkingBear    Views (2,198)     comment (0)

Jun26
What is Environmental Stress Screening (ESS)?

post on June 26, 2025

Environmental Stress Screening (ESS) is a method used to apply certain environmental and operational stresses—such as power on/off cycles, bias voltage, pressure, thermal cycling, and vibration—to new or repaired products (usually electronics or components). The idea is to expose hidden … Continue reading →

Process, Quality, Reliability, Test/Inspection     WorkingBear    Views (3,951)     comment (0)

Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons

post on March 21, 2025

In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading →

Process, Quality, Reliability, Test/Inspection     WorkingBear    Views (3,861)     comment (0)

Jan16
Inspection Methods for BGA Solder Ball Wettability and Soldering Defects

post on January 16, 2025

This is a summary post aimed at providing some guidance to newcomers in the electronics assembly field on methods for analyzing the solderability of BGA (Ball Grid Array) solder balls. Workingbear decided to write this after seeing someone ask about … Continue reading →

Quality, Soldering, Test/Inspection     WorkingBear    Views (7,329)     comment (0)
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