Seach This Blog
Tag Cloud
AOI Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx Discoloration ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Uncategorized
Apr08
How I Troubleshoot Hidden Open Circuits in FPCs
Flexible printed circuits (FPCs) are widely used because they can bend and fold. They’re perfect for compact products or for connecting signals between different PCBAs. But there’s a downside. As usage increases—especially in applications with repeated motion—FPCs can develop open circuits or … Continue reading
Jan29
How Component Suppliers Can Break Into System Companies as a 2nd-Source Supplier
Many component suppliers work extremely hard to get into certain companies as approved suppliers. Playing the “pretty salesperson card” is a common tactic—while engineers may appreciate it, most of the time it still doesn’t open the door. So where does … Continue reading
