Category Archives: Design
Oct14
How to Strengthen BGA Solder Joints Through Design to Prevent Cracking
Figcaption: How to Strengthen BGA Solder Joints Through Design to Prevent Cracking Recently, several colleagues have asked me the same question: How can we improve BGA design to strengthen solder joints and prevent BGA solder ball cracking? The question came … Continue reading
Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading
Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement
Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading
Jul22
Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance
Figcaption: Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance Do you know the difference between SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs for PCB? What are the advantages and disadvantages … Continue reading
Jun30
What Does CMF Mean in New Product Development Meetings?
What Does CMF Mean in New Product Development Meetings? During new product development meetings, We often hears project managers (PMs) asking mechanical engineers (MEs) to confirm the CMF with the Industrial Design (ID) and Marketing teams before moving forward with … Continue reading
