Category Archives: Design


Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause

Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading →

Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement

Figcaption:BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading →

Jul22
Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance

Figcaption: Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance Do you know the difference between SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs for PCB? What are the advantages and disadvantages … Continue reading →

Jun30
What Does CMF Mean in New Product Development Meetings?

What Does CMF Mean in New Product Development Meetings? During new product development meetings, We often hears project managers (PMs) asking mechanical engineers (MEs) to confirm the CMF with the Industrial Design (ID) and Marketing teams before moving forward with … Continue reading →

Jun25
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development

What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development(This article discusses POC from the perspective of electronic hardware product development. Since Workingbear is not familiar with software development, POC practices … Continue reading →