Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Design
Apr15
Common Ways to Connect FPC to PCB: What Actually Works
As electronics keep getting smaller and more advanced, the need to connect flexible printed circuits (FPCs) to rigid PCBs continues to grow. In this article, Workingbear will walk you through the most common methods used in the industry today—and share some … Continue reading
Mar26
How to Design FPC-to-PCB Connections for Better Assembly (DFx)
As electronic devices keep getting thinner and more compact, FPCs (flexible printed circuits) are used more and more. In some designs, FPCs even replace traditional PCBs. But no matter how advanced FPC technology becomes, it still needs to connect to … Continue reading
Jun12
Impact Drop Test Requirements in Electronic Product Development
During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases: Product Drop Test – Testing the device without packaging. Packagage Drop Test – Evaluating the … Continue reading
Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing
From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
