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Category Archives: Design
Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement
Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading
Jul22
Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance
Figcaption: Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance Do you know the difference between SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs for PCB? What are the advantages and disadvantages … Continue reading
Jun30
What Does CMF Mean in New Product Development Meetings?
What Does CMF Mean in New Product Development Meetings? During new product development meetings, We often hears project managers (PMs) asking mechanical engineers (MEs) to confirm the CMF with the Industrial Design (ID) and Marketing teams before moving forward with … Continue reading
Jun25
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development(This article discusses POC from the perspective of electronic hardware product development. Since Workingbear is not familiar with software development, POC practices … Continue reading
Jun09
How Pilot Production Helps Improve DFM, Process Stability, and Product Quality
Figure: Why Do New Products Need Pilot Production? Exploring the Challenges, Benefits, and Lessons Learned Many manufacturing professionals aren’t exactly excited when they’re assigned to a new product pilot build. Pilot production is often complex, fast-paced, and difficult to measure … Continue reading
