Category Archives: Design


Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End

Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading

Jul04
Exploring EVT/DVT/PVT: Explaining the Three Crucial Validation Stages in New Product Development

When developing a new product, it is common to conduct a “trial run” to obtain a prototype sample. This serves two purposes: firstly, it allows developers to further test and validate the prototype’s functionality, and secondly, it helps the manufacturing … Continue reading

Jun20
Preventing BGA Solder Joint Cracking: Strengthening Design from the Source

BGA solder joint cracking has always been a nightmare for electronic assembly (industry) manufacturer, and there are many reasons that are beyond the control of assembly manufacturer, but the final result is often required to be borne by assembly manufacturer. … Continue reading

May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs

Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the advantages and disadvantages for them? What are the design recommendations for them? … Continue reading

Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials

The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has … Continue reading