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Category Archives: EDX/EDS/SEM/IMC/FTIR
Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading
Jul16
BGA Failure Analysis: Manufacturing Issue or Design Flaw?
Figcaption: How to Determine Whether a BGA Solder Joint Crack or Component Detachment Is Caused by the SMT Process or Product Design Many engineers have asked the same question: When a BGA solder joint cracks or a BGA component falls … Continue reading
Jul16
Youtube: QC 7 Tools – Fishbone (Cause & Effect Analysis) Diagram Introduction
Many of you might already know what a fishbone diagram is. But do you know how to actually draw one? And what should you watch out for when creating one? As the name suggests, the diagram looks like the skeleton … Continue reading
Jul10
Customer Complaint About Oil Contamination on PCB: Who’s the Real Culprit? (FTIR Analysis)
In the previous article, Workingbear mentioned a serious DOA (Dead on Arrival) customer complaint involving one of the company’s products. Most of the defective units had unresponsive keypads—specifically the 3, 6, and 9 buttons—and it was eventually traced back to … Continue reading
Jul03
[Case Study] Troubleshooting a Customer Complaint – Keypad Malfunction Caused by Oil & Powder Contamination on the PCB
This article shares a real case from Workingbear’s past experience dealing with an urgent customer complaint. One day, Workingbear was suddenly assigned to fly to a factory in China to “hunt for oil.” My manager even warned, “If you don’t … Continue reading
