Category Archives: Glue/adhesive/epoxy/underfill,

What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

The “SMT dispensing” process,  also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB).  The term “SMT Red Glue” … Continue reading

Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End

Many colleagues in the company have been asking WorkingBear recently for advice on designing  BGA (Ball Grid Array) to prevent solder cracking and enhance its strength. This request comes after a senior expressed concerns during a new product development meeting, … Continue reading

How to Determine Whether Underfill is Needed for BGA?

A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading

Underfill Techniques for Enhanced BGA and CSP Assembly

“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability. Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) … Continue reading

Why do thinner PCBs will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading