Category Archives: Glue/adhesive/epoxy/underfill,
Oct14
How to Strengthen BGA Solder Joints Through Design to Prevent Cracking
Figcaption: How to Strengthen BGA Solder Joints Through Design to Prevent Cracking Recently, several colleagues have asked me the same question: How can we improve BGA design to strengthen solder joints and prevent BGA solder ball cracking? The question came … Continue reading
May30
Conformal Coating: How to Understand and Choose the Right Material
Conformal coating is a protective chemical coating or polymer film applied to printed circuit boards (PCBs) and critical electronic components to protect them from environmental factors such as moisture, dust, chemicals, and temperature extremes. This coating, typically 25 to 300 … Continue reading
Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?
The “SMT dispensing” process, also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB). The term “SMT Red Glue” … Continue reading
Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End
Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading
Jun13
How to Determine Whether Underfill is Needed for BGA?
A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading
