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Author Archives: WorkingBear
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
Jan05
Comparison between shielding-can directly mount and shielding-clip/frame
Recently my top manager ask to mount the shielding-can or shielding-cover directly on the board to instead of mount the shielding-clip or shielding-frame on the board first then cover the shieling-can. He said this new process is more cheap and … Continue reading
May03
Trouble Shooting Guide for Plastic Injection
Trouble Suggested Remedies (Solutions) DIMENSIONAL PROBLEMS Shot-to-shot dimensional variations Increase injection pressure Maintain uniform pad (cushion) Repair leaking back flow value if pad cannot be maintained Increase screw forward time Maintain uniform cycle Eliminate un-melted particles (see below) Use … Continue reading
Apr07
Solution to the Drop of First-Side Part during the Second Reflow Soldering
First of all, with the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes meet serious labor shortage. Second, the Industry 4.0 promotes the requirement of factory automation for each EMS. Therefore, many parts … Continue reading
Mar09
Process Impact of Substituting SMD Parts with Paste-In-Hole Parts
Today, one question from my boss, “Is there any difference or influence on the process and design if we like to convert the SMD parts to DIP type and go through the PIH(Paste-In-Hole) process?” Later, I realized that the question … Continue reading
