Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination DFx ECM (Electrochemical migration) ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
Jul03
[Case Study] Troubleshooting a Customer Complaint – Keypad Malfunction Caused by Oil & Powder Contamination on the PCB
This article shares a real case from Workingbear’s past experience dealing with an urgent customer complaint. One day, Workingbear was suddenly assigned to fly to a factory in China to “hunt for oil.” My manager even warned, “If you don’t … Continue reading
Jun26
What is Environmental Stress Screening (ESS)?
Environmental Stress Screening (ESS) is a method used to apply certain environmental and operational stresses—such as power on/off cycles, bias voltage, pressure, thermal cycling, and vibration—to new or repaired products (usually electronics or components). The idea is to expose hidden … Continue reading
Jun19
What Is EDX/EDS? A Beginner’s Guide to Elemental Analysis in Materials Science
Energy-Dispersive X-ray Spectroscopy (EDS or EDX) is a common, non-destructive technique used in the industry to quickly identify the elemental composition of a sample’s surface. In electronics manufacturing and material analysis, knowing what elements are present is critical for quality … Continue reading
Jun12
Impact Drop Test Requirements in Electronic Product Development
During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases: Product Drop Test – Testing the device without packaging. Packagage Drop Test – Evaluating the … Continue reading
Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing
From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading