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Author Archives: WorkingBear
Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading
Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the most weakness location of the solder … Continue reading
Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
This article will talk about the composition of the PCBA bonding-force. The PCBA bonding-force actually contains many items and factors. But working-bear think we can refer to the conclusion of red-dye test to discuss it. The BGA red dye and … Continue reading
Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force
What is the actual root cause of BGA ball cracked? Stress is greater than its bonding-forces. The root cause of BGA solder ball cracked is stress greater than bonding-forces. Stress is greater than bonding-force is the certain result of BGA … Continue reading
Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？
What is the IMC, the Intermetallic Compound? We always heard the manufacturing engineer or some of Mechanical Engineer talking about this keyword when discussed to the soldering quality or component drop issue. So, what is the role of IMC layer … Continue reading
