Author Archives: WorkingBear


Oct14
How to Strengthen BGA Solder Joints Through Design to Prevent Cracking

Figcaption: How to Strengthen BGA Solder Joints Through Design to Prevent Cracking Recently, several colleagues have asked me the same question: How can we improve BGA design to strengthen solder joints and prevent BGA solder ball cracking? The question came … Continue reading →

Sep30
What Is HASL Surface Finish? Advantages and Disadvantages

Figcaption: What Is HASL Surface Finish? Advantages and Disadvantages HASL stands for Hot Air Solder Leveling and is one of the most common PCB surface finishes. It is commonly referred to simply as HASL or a solder coating. During the … Continue reading →

Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause

Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading →

Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them

Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading →

Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids

Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading →