Seach This Blog
Tag Cloud
AOI Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx Discoloration ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH PLC Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
Jul16
BGA Failure Analysis: Manufacturing Issue or Design Flaw?
Figcaption: How to Determine Whether a BGA Solder Joint Crack or Component Detachment Is Caused by the SMT Process or Product Design Many engineers have asked the same question: When a BGA solder joint cracks or a BGA component falls … Continue reading
Jul08
BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects
Figcaption：BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects This article is intended for anyone who isn’t yet familiar with how to evaluate the quality of BGA solder joints from cross-section images. Workingbear happens to have … Continue reading
Jun30
What Does CMF Mean in New Product Development Meetings?
What Does CMF Mean in New Product Development Meetings? During new product development meetings, We often hears project managers (PMs) asking mechanical engineers (MEs) to confirm the CMF with the Industrial Design (ID) and Marketing teams before moving forward with … Continue reading
Jun25
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development(This article discusses POC from the perspective of electronic hardware product development. Since Workingbear is not familiar with software development, POC practices … Continue reading
Jun17
What Are WIP (Work-in-Process), FGI (Finished Goods Inventory), and Semi-Finished Goods?
Filgure: What Are WIP (Work-in-Process), FGI (Finished Goods Inventory), and Semi-Finished Goods? WIP stands for Work-in-Process (or Work-in-Progress), which refers to products that are currently going through the manufacturing process but have not yet been completed. In a broad sense, … Continue reading
