Author Archives: WorkingBear

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Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution

Today, most of electronic parts are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading

Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

Today, the SMD parts become smaller and smaller. Their sizes can be developed to 0402, 0201, and even 01005 (Note 1). Moreover, the pitch between the pins of a common IC (integrated circuit) is shorten to fine pitch of 0.5mm, … Continue reading

Oct01
Cooper Defined vs. Solder Mask Defined pad design for BGA soldering strength

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading

Jul01
Why thinner PCB will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear always find there is rope wall between R&D, Marketing and Manufacturer. The R&D and Marketing always like the design be thin, sleek, and modern looking. The manufacturer always like the assembly be … Continue reading

Jun24
Case study for the mold-in insert screw boss broken

Last time WorkingBear mentioned the potential root causes to bring the screw boss crack after mold-in screw nut insert. Actually we received the complaint from the field then asked EMS and plastic supplier to double check their inventory and found … Continue reading

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