Category Archives: Moisture Sensitive

Mar06
What is the Popcorn Effect in PCBs and Electronic Components?

post on March 6, 2025

The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, Reliability     WorkingBear    Views (1,221)     comment (0)
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Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?

post on July 27, 2023

WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (3,548)     comment (0)
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Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

post on April 21, 2023

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading →

Manufacture, Moisture Sensitive, Process, Quality, SMT     WorkingBear    Views (3,888)     comment (0)