Tag Archives: Reliability

Subject Title	Views	Comments
Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change	Views (179)	(0)
Why BGA soldering ball always crack(9)? Increase the resistance of components to stress	Views (244)	(0)
Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending	Views (515)	(0)
Why BGA soldering ball always crack(7)? The Bonding force between solder pad of copper foil and PCB substrate	Views (765)	(0)
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength	Views (16,679)	(0)