Tag Archives: Reliability

Subject Title	Views	Comments
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?	Views (1,535)	(0)
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow	Views (2,977)	(0)
How to Determine Whether Underfill is Needed for BGA?	Views (3,763)	(0)
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs	Views (5,610)	(0)
Underfill Techniques for Enhanced BGA and CSP Assembly	Views (4,184)	(0)