Category Archives: Reliability


Sep19
Does the Gold Thickness in ENIG PCBs Affect Component Detachment?

post on September 19, 2024

Does the Gold Thickness in ENIG PCBs Affect Component Detachment? Do you know how the thickness of the gold layer in ENIG surface-finished PCBs impacts soldering quality? What role does the gold layer play in PCBA soldering? How could the … Continue reading →

PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (298)     comment (0)
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Aug01
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures

post on August 1, 2024

In recent years, the commercial application of 3D CT X-Ray has become increasingly noteworthy. As the technology matures, more companies are investing in its development, making the equipment more affordable, though still not quite at a consumer-friendly price point. Additionally, … Continue reading →

Quality, Reliability, SMT, Soldering, Test/Inspection     WorkingBear    Views (918)     comment (0)
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Jul18
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?

post on July 18, 2024

In the early days, when electronic component design and manufacturing were still developing, the “burn-in” solution was used to screen out defective electronic components and products. This process allowed early-failing products to be identified and eliminated, preventing defective items from … Continue reading →

Process, Quality, Reliability, Test/Inspection     WorkingBear    Views (975)     comment (0)
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May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints

post on May 2, 2024

In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading →

Quality, Reliability, SMT, Soldering     WorkingBear    Views (1,563)     comment (0)
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Feb06
Purpose of Using Lead-Free Low-Temperature Solder (LTS) SnBi, SnBiAg in Soldering

post on February 6, 2024

The alloy composition of lead-free LTS (Low Temperature Solder) usually includes the metal “bismuth (Bi)” in addition to tin (Sn) to lower its eutectic point. The commonly used lead-free solder SAC305 has a melting point of 217°C, while Sn64Bi35Ag1 has … Continue reading →

Quality, Reliability, SMT, Soldering     WorkingBear    Views (1,308)     comment (0)
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