Category Archives: Reliability


Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause

post on September 16, 2026

Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading →

Design, EDX/EDS/SEM/IMC/FTIR, PCB/FPC/PTF, Process, Quality, Reliability, Soldering     WorkingBear    Views (271)     comment (0)
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Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them

post on September 9, 2026

Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading →

Quality, Reliability, Soldering     WorkingBear    Views (308)     comment (0)
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Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids

post on September 2, 2026

Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading →

Quality, Reliability, Soldering     WorkingBear    Views (250)     comment (0)
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Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement

post on August 25, 2026

Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading →

Case study, Design, Quality, Reliability     WorkingBear    Views (379)     comment (0)
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Apr02
Root Cause Analysis: Why FPC Traces Break

post on April 2, 2026

Recently, my company started seeing an increase in field returns caused by open circuits in flexible printed circuits (FPCs) inside the terminal. After digging into several cases, the root cause turned out to be broken copper traces. So what’s going … Continue reading →

Case study, PCB/FPC/PTF, Process, Quality, Reliability     WorkingBear    Views (1,451)     comment (0)