Tag Archives: HIP(Head-In-Pillow)

Subject Title	Views	Comments
Inspection Methods for BGA Solder Ball Wettability and Soldering Defects	Views (588)	(0)
Using 2D X-Ray to Diagnose BGA Solder Void Issues	Views (1,013)	(0)
How to Use 2D X-Ray to Identify BGA Issues like Non-Wetting, Cold Solder, and HIP or NWO	Views (1,411)	(0)
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures	Views (1,100)	(0)
Effects of Nitrogen (N2) in SMT Reflow on Various Soldering Defects	Views (1,338)	(0)