The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the most weakness location of the solder bonding-force.
As we meniotned in previous page that PCBA bonding-force shall include 5 kinds of defect positions at least. The IMC layers usually is the most weakness locations show on the solder bonding-force base on forming good PCBA solder. Why?
The IMC is the abbreviation of InterMetallic Compound in the electronica manufacturing industry. The IMC layer is the certain result of the chemical reaction to form the soldering joint. Working-Bear describes the IMC layer just like the girl and boy marry then have a child.