Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints

發表於 November 13, 2019

The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the most weakness location of the solder bonding-force.

As we meniotned in previous page that PCBA bonding-force shall include 5 kinds of defect positions at least. The IMC layers usually is the most weakness locations show on the solder bonding-force base on forming good PCBA solder. Why?

The IMC is the abbreviation of InterMetallic Compound in the electronica manufacturing industry. The IMC layer is the certain result of the chemical reaction to form the soldering joint. Working-Bear describes the IMC layer just like the girl and boy marry then have a child.

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Design, SMT, Soldering     WorkingBear    Views (1,735)     comment (0)
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Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force

發表於 October 30, 2019

This article will talk about the composition of the PCBA bonding-force.

The PCBA bonding-force actually contains many items and factors. But working-bear think we can refer to the conclusion of red-dye test to discuss it. The BGA red dye and pry test summary the crack as 5 kinds of defect positions. These locations also can be applied to the PCBA all soldering issues.

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Design, SMT, Soldering     WorkingBear    Views (1,587)     comment (0)
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Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force

發表於 September 25, 2019

What is the actual root cause of  BGA ball cracked? Stress is greater than its bonding-forces.

The root cause of BGA solder ball cracked is stress greater than bonding-forces.

Stress is greater than bonding-force is the certain result of BGA solder ball cracked.

BGA solder ball cracked is the certain result of stress greater than bonding-forces.

Working-Bear spent lots of time to prepare this serial article. Don’t just do copy and paste to steal my babies. There will be total 13+1 articles in this blog mentioned the BGA (Ball Grid Array) component drop and solder balls cracked issue. The most concepts that you may know already but here I summary them together systematically and let you read them easily.

“Stress > Bonding-force”

is the root cause of electronic components drop from the PCB and solder crack.

This is not the first time that Working-Bear be challenged the soldering problem from R&D once the NPI run found any components has solder crack. Our RD always came to me and challenged why EMS can’t make thing right to guarantee the solderability. Some RD even ask me need to increase the solder paste volume to improve the soldering strength. It is really enough!

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Design, SMT, Soldering     WorkingBear    Views (1,686)     comment (0)
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Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？

發表於 December 19, 2018

IMC_Intermetallic_compound

What is the IMC, the Intermetallic Compound? We always heard the manufacturing engineer or some of Mechanical Engineer talking about this keyword when discussed to the soldering quality or component drop issue. So, what is the role of IMC layer in the soldering? Does IMC layer will affect the soldering strength and solderability? What is the best IMC layer thickness?

The IMC is the abbreviation of InterMetallic Compound in the electronic manufacturing industry.  The IMC usually grows between the solder alloy and Cu or Ni substrate for the Printed Circuit Board Assembly (PCBA). The IMC is neither a pure metal element nor alloy (Some expert think IMC is a kind of alloy). The IMC is a chemical compound that chemically combined by two or more elements. So, you may see the chemical formula of IMC like Cu6Sn5、Ni3Sn4、AuSn4…etc.

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Process, Soldering     WorkingBear    Views (4,302)     comment (0)

Dec05
Both solder joint bridging and open solder joint happen at same BGA?

發表於 December 5, 2018

Is that possible both solder joint bridging and open solder joint defect happen at same BGA (Ball Grid Array) or CSP (Chip Scale Package) device?BGA cry down（電路板則因為TAL(Time Above Liquidous)過長，與迴焊爐的上下爐溫溫差過大，兩相交互作用下形成電路板板邊下彎，造成了所謂的哭臉曲線）

Is that possible both solder joint bridging and open solder joint defect happen at same BGA (Ball Grid Array) or CSP (Chip Scale Package) device?

It is hard to see both solder joint bridging and open solder joint defect happen at same BGA device in the general situation, but it is still possible. There is a case that BGA substrate and PCB has a big deviation of CTE (Coefficient of Thermal Expansion) then make the BGA substrate with smile-up curve (concave) deformation and PCB with cry-down curve (convex) due to longer TAL (Time Above Liquidus) or big temperature deviation between above and below heater in the reflow oven.

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Process, Quality, Soldering     WorkingBear    Views (1,910)     comment (0)
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