Recently, several colleagues have asked me the same question: How can we improve BGA design to strengthen solder joints and prevent BGA solder ball cracking?
The question came up after a senior executive made it clear during a product development meeting that someone would have to take responsibility if customers continued to report BGA cracking issues. This kind of reaction is not uncommon in product development, but it raises a more important question: Are we addressing the root cause, or are we simply putting more pressure on the engineering team?
