“Oxidation” is a major enemy of solder quality, but oxidation is a natural law of elements striving for stability that cannot be avoided. Using nitrogen (N2) to isolate solder from oxygen (O2) is one of the few effective methods currently available to reduce oxidation of electronic components during high-temperature soldering.
Although nitrogen (N2) is not one of the noble gases of Group 8A, it is classified as an “inert gas” in modern chemistry. Nitrogen is very unreactive in nature, making it unlikely to form compounds with metals. It also makes up 78% of the atmosphere, making it relatively inexpensive to obtain. As a result, nitrogen is often used in SMT reflow ovens to replace oxygen, and in some wave soldering ovens, to reduce oxidation of solder or PCB pads at high temperatures.
