Nov21
What Are PCB Cross-out Boards (X-out Boards)?

post on November 21, 2024

What Are PCB Cross-out Boards (X-out Boards)? | Definition and Explanation of Defective PCBs

In the PCB industry, there is a specific term called “Cross-out boards” or “X-out boards” to indicate that a panel of PCBs contains defective boards. The term “Cross” refers to marking these defective boards with an “X” symbol.

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PCB/FPC/PTF     WorkingBear    Views (3,900)     comment (0)
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Nov07
The Benefits of Using “Mirrored Panelization” for PCBs

post on November 7, 2024

The Benefits of Using

In the electronics assembly manufacturing industry, what we commonly refer to as a “Mirrored Panel Board” or “Flipped Panel Board” actually comes in two types. The first type is a different-side mirrored panel board, where one board’s top side and another board’s bottom side appear on the same panel. The second type is a same-side mirrored panel board, where all boards are oriented on the same side but are mirrored left to right, such as in a “pdpd” layout pattern.

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PCB/FPC/PTF, Process, SMT     WorkingBear    Views (2,518)     comment (0)

Oct31
The Limitations of Using “Mirrored Panels” or “Flipped Panels” in SMT

post on October 31, 2024

The Limitations of Using "Mirrored Panels" or "Flipped Panels" in SMT

We all know that when producing PCBs and PCBAs, multiple individual PCBs are usually combined into one larger panel, a process called panelization, to improve production efficiency. Typically, these individual boards are arranged in a neat and consistent manner with the same orientation. However, when the PCB has an irregular shape or special requirements, a mirrored panel or flipped panel design might be used. While this design can improve efficiency in the SMT production line and reduce material costs, it may also come with certain design and production challenges. In this article, we will explore these issues and consider potential solutions.

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PCB/FPC/PTF, Process, SMT     WorkingBear    Views (3,355)     comment (0)

Oct24
Causes and Prevention of PCB Warping and Bending After Reflow

post on October 24, 2024

Causes and Prevention of PCB Warping and Bending After Reflow

A reader recently asked: “In surface mount assembly, PCBs often warp or bend after going through the reflow process, which can cause issues like open solder joints or tombstoning. How can we overcome this?”

To be honest, the reasons behind PCB warping or bending may vary, but they can generally be traced back to the stress applied to the PCB exceeding what the material can handle. When stress is uneven across the PCB or when different areas of the PCB resist stress unevenly, warping or bending occurs.

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PCB/FPC/PTF, Quality, SMT     WorkingBear    Views (5,705)     comment (0)

Oct17
Benefits and Drawbacks of Using Nitrogen (N2) in SMT Reflow Ovens: Optimizing Soldering Quality and Reducing Oxidation

post on October 17, 2024

Benefits and Drawbacks of Using Nitrogen (N2) in SMT Reflow Ovens: Optimizing Soldering Quality and Reducing Oxidation

The primary purpose of adding Nitrogen (N2) to the SMT reflow oven is to reduce oxidation on the soldering surface and improve the wettability of the solder joints. Nitrogen is a colorless, odorless, and chemically inactive gas. It belongs to the category of inert gases, meaning it doesn’t easily react with most metals to form compounds. By using nitrogen to replace the oxygen in the environment, we can prevent metals from reacting with oxygen, thus avoiding oxidation.

(This is a summary article, and the views expressed may not be entirely accurate. If you find any issues, feel free to share your opinions or feedback.)

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Quality, SMT, Soldering     WorkingBear    Views (7,512)     comment (0)
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