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Category Archives: Case study
Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement
Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading
Apr02
Root Cause Analysis: Why FPC Traces Break
Recently, my company started seeing an increase in field returns caused by open circuits in flexible printed circuits (FPCs) inside the terminal. After digging into several cases, the root cause turned out to be broken copper traces. So what’s going … Continue reading
Jul16
Youtube: QC 7 Tools – Fishbone (Cause & Effect Analysis) Diagram Introduction
Many of you might already know what a fishbone diagram is. But do you know how to actually draw one? And what should you watch out for when creating one? As the name suggests, the diagram looks like the skeleton … Continue reading
Jul10
Customer Complaint About Oil Contamination on PCB: Who’s the Real Culprit? (FTIR Analysis)
In the previous article, Workingbear mentioned a serious DOA (Dead on Arrival) customer complaint involving one of the company’s products. Most of the defective units had unresponsive keypads—specifically the 3, 6, and 9 buttons—and it was eventually traced back to … Continue reading
Jul03
[Case Study] Troubleshooting a Customer Complaint – Keypad Malfunction Caused by Oil & Powder Contamination on the PCB
This article shares a real case from Workingbear’s past experience dealing with an urgent customer complaint. One day, Workingbear was suddenly assigned to fly to a factory in China to “hunt for oil.” My manager even warned, “If you don’t … Continue reading
