-
Archives
- September 2026
- August 2026
- July 2026
- June 2026
- May 2026
- April 2026
- March 2026
- February 2026
- January 2026
- December 2025
- November 2025
- October 2025
- September 2025
- August 2025
- July 2025
- June 2025
- May 2025
- April 2025
- March 2025
- February 2025
- January 2025
- December 2024
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- July 2021
- November 2019
- October 2019
- September 2019
- December 2018
- November 2018
- June 2017
- January 2017
- May 2016
- April 2016
- March 2016
- February 2016
- January 2016
- October 2015
- July 2015
- June 2015
- May 2015
- April 2015
-
Meta
Monthly Archives: June 2025
Jun26
What is Environmental Stress Screening (ESS)?
Environmental Stress Screening (ESS) is a method used to apply certain environmental and operational stresses—such as power on/off cycles, bias voltage, pressure, thermal cycling, and vibration—to new or repaired products (usually electronics or components). The idea is to expose hidden … Continue reading
Jun19
What Is EDX/EDS? A Beginner’s Guide to Elemental Analysis in Materials Science
Energy-Dispersive X-ray Spectroscopy (EDS or EDX) is a common, non-destructive technique used in the industry to quickly identify the elemental composition of a sample’s surface. In electronics manufacturing and material analysis, knowing what elements are present is critical for quality … Continue reading
Jun12
Impact Drop Test Requirements in Electronic Product Development
During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases: Product Drop Test – Testing the device without packaging. Packagage Drop Test – Evaluating the … Continue reading
Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing
From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading