Category Archives: SMT

How Preventing Heavy Components from Falling during Secondary time SMT Reflow

With the rapid advancement of mobile communication technology, EMS (Electronic Manufacturing Services) providers worldwide are facing severe labor shortages. Furthermore, the Industry 4.0 trend has heightened the demand for automation in EMS facilities. As a result, many components that were … Continue reading

When does SMT require Reflow Carriers and Full Process Carriers?

What is an SMT Reflow Carrier? Why is it sometimes necessary in SMT production? And when do we need an SMT Full Process Carrier? Are there situations where neither is required? The so-called “SMT reflow carriers or reflow templates” are … Continue reading

Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX

This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading

How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH

The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading

Do PCB Designs Require Reserving Board Edges and Grooves for Routers De-Paneling Machines?

A while back, a netizen asked how the Router de-panel machine cuts PCB panels and whether there’s a need to reserve board edges (break-away) for the Router machine in PCB design. Upon careful consideration, I thought my previous answer might … Continue reading