Category Archives: SMT


Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints

The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the most weakness location of the solder … Continue reading

Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force

This article will talk about the composition of the PCBA bonding-force. The PCBA bonding-force actually contains many items and factors. But working-bear think we can refer to the conclusion of red-dye test to discuss it. The BGA red dye and … Continue reading

Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force

What is the actual root cause of  BGA ball cracked? Stress is greater than its bonding-forces. The root cause of BGA solder ball cracked is stress greater than bonding-forces. Stress is greater than bonding-force is the certain result of BGA … Continue reading

Nov14
How to print solder paste on PC Board and screen printing notices?

Printing the solder paste on the PCB (Printed Circuit Board) and go through reflow oven to re-melt the solder paste and solder the electronic components on PCB is most common process in today’s electronics manufacturing industry. Printing the solder paste … Continue reading

Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading