Category Archives: SMT
Oct28
A Collection of Articles on Component Detachment and BGA Solder Joint Cracking
Figure: BGA solder joint craking: causes, analysis & reliability solutions. BGA solder joint cracking is one of the most challenging issues I’ve encountered throughout my career in electronics manufacturing. It’s also one of the topics that comes up most often … Continue reading
Oct21
Can Increasing Solder Paste Volume Improve BGA Soldering Defects Such as HIP?
X-ray image of a BGA showing more solder on the outer rows than on the inner rows. Improving BGA solder joint quality is an ongoing goal for SMT engineers, especially when working with fine-pitch BGA components. In general, BGAs with … Continue reading
Oct14
How to Strengthen BGA Solder Joints Through Design to Prevent Cracking
Figcaption: How to Strengthen BGA Solder Joints Through Design to Prevent Cracking Recently, several colleagues have asked me the same question: How can we improve BGA design to strengthen solder joints and prevent BGA solder ball cracking? The question came … Continue reading
Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test
Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading
Aug12
BGA Solder Ball Crack Analysis Using the Red Dye Test | Types and Failure Patterns
Figure: Use the Red Dye Test to Identify BGA Solder Ball Cracks: Failure Patterns and Practical Analysis BGA IC functional failures are a major headache for many electronics companies. This is especially true today, as most CPUs use BGA packages. … Continue reading
