Category Archives: SMT


Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution

Today, most of electronic parts are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading

Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

Today, the SMD parts become smaller and smaller. Their sizes can be developed to 0402, 0201, and even 01005 (Note 1). Moreover, the pitch between the pins of a common IC (integrated circuit) is shorten to fine pitch of 0.5mm, … Continue reading

Oct01
Cooper Defined vs. Solder Mask Defined pad design for BGA soldering strength

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading

Jun17
Selectively increase solder paste volume solutions

Why need to partially increase the solder paste volume? This is in order to meet current smaller and thinner electric component design, the stencil thickness is made as thin as possible to accurately control the tiny solder paste which print … Continue reading

Apr27
How EMS fabricate a PCB Assembly?

How EMS (Electronic Manufacturing Services) fabricate a PCB (Printed Circuit Board) Assembly? This article is writing for the people who still not yet really under what is the PCB Assembly. Because WorkingBear found there are many people just come to … Continue reading