Category Archives: SMT

Page 2 of 212

What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

Today, the SMD parts become smaller and smaller. Their sizes can be developed to 0402, 0201, and even 01005 (Note 1). Moreover, the pitch between the pins of a common IC (integrated circuit) is shorten to fine pitch of 0.5mm, … Continue reading

Cooper Defined vs. Solder Mask Defined pad design for BGA soldering strength

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading

Selectively increase solder paste volume solutions

Why need to partially increase the solder paste volume? This is in order to meet current smaller and thinner electric component design, the stencil thickness is made as thin as possible to accurately control the tiny solder paste which print … Continue reading

How EMS fabricate a PCB Assembly?

How EMS (Electronic Manufacturing Services) fabricate a PCB (Printed Circuit Board) Assembly? This article is writing for the people who still not yet really under what is the PCB Assembly. Because WorkingBear found there are many people just come to … Continue reading

The benefit to use shielding clips to instead of shielding frame

For almost of the frequency radio apparatus, the Printed Circuit board must design the shielding frame/can to prevent the EMI (Electromagnetic Disturbance Interference) effect. The regular design will apply one shielding frame to mount on PCB by solder and another … Continue reading

Page 2 of 212