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Category Archives: Soldering
Jul22
Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance
Figcaption: Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance Do you know the difference between SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs for PCB? What are the advantages and disadvantages … Continue reading
Jul16
BGA Failure Analysis: Manufacturing Issue or Design Flaw?
Figcaption: How to Determine Whether a BGA Solder Joint Crack or Component Detachment Is Caused by the SMT Process or Product Design Many engineers have asked the same question: When a BGA solder joint cracks or a BGA component falls … Continue reading
Jul08
BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects
Figcaption：BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects This article is intended for anyone who isn’t yet familiar with how to evaluate the quality of BGA solder joints from cross-section images. Workingbear happens to have … Continue reading
Apr15
Common Ways to Connect FPC to PCB: What Actually Works
As electronics keep getting smaller and more advanced, the need to connect flexible printed circuits (FPCs) to rigid PCBs continues to grow. In this article, Workingbear will walk you through the most common methods used in the industry today—and share some … Continue reading
Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading
