Category Archives: Soldering


Sep30
What Is HASL Surface Finish? Advantages and Disadvantages

post on September 30, 2026

Figcaption: What Is HASL Surface Finish? Advantages and Disadvantages HASL stands for Hot Air Solder Leveling and is one of the most common PCB surface finishes. It is commonly referred to simply as HASL or a solder coating. During the … Continue reading →

PCB/FPC/PTF, Soldering, Uncategorized     WorkingBear    Views (75)     comment (0)
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Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause

post on September 16, 2026

Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading →

Design, EDX/EDS/SEM/IMC/FTIR, PCB/FPC/PTF, Process, Quality, Reliability, Soldering     WorkingBear    Views (340)     comment (0)
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Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them

post on September 9, 2026

Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading →

Quality, Reliability, Soldering     WorkingBear    Views (376)     comment (0)
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Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids

post on September 2, 2026

Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading →

Quality, Reliability, Soldering     WorkingBear    Views (299)     comment (0)
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Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test

post on August 19, 2026

Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye  Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (467)     comment (0)
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