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Category Archives: Soldering
May16
What is the difference between PCB and PCBA? PCB is like land with roads, but it doesn’t have buildings yet
What is the difference between PCB and PCBA? This is actually something that should be easily understood, but since someone asked, Workingbear will try explain it briefly here. If any readers notice any errors, please feel free to correct me. … Continue reading
May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs
Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the advantages and disadvantages for them? What are the design recommendations for them? … Continue reading
Apr13
Red Dye Penetration Test to check for BGA solder joint cracking
The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on … Continue reading
Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading
Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress
Manufacturing processes that may result in high stress in factories Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.
