Category Archives: Process

Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry?

What is the IMC? We always heard the manufacturing engineer talking about this keyword when discussing to the soldering quality. What is the role of IMC layer in the soldering? Does IMC layer will affect the soldering strength and solderability? … Continue reading

Dec05
Both solder joint bridging and open solder joint happen at same BGA?

Is that possible both solder joint bridging and open solder joint defect happen at same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is hard to see both solder joint bridging and open solder joint defect happen … Continue reading