Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Process
Apr02
Root Cause Analysis: Why FPC Traces Break
Recently, my company started seeing an increase in field returns caused by open circuits in flexible printed circuits (FPCs) inside the terminal. After digging into several cases, the root cause turned out to be broken copper traces. So what’s going … Continue reading
Mar26
How to Design FPC-to-PCB Connections for Better Assembly (DFx)
As electronic devices keep getting thinner and more compact, FPCs (flexible printed circuits) are used more and more. In some designs, FPCs even replace traditional PCBs. But no matter how advanced FPC technology becomes, it still needs to connect to … Continue reading
Jan14
Explaining the Relationship Between BOM, AML, AVL, and MPN
BOMs, AML/AVL, and MPNs are essentially the “recipe” behind electronics manufacturing. All of these terms are closely related to a product’s material list. Understanding what they mean is not difficult—the real challenge is knowing how to apply them effectively to … Continue reading
Jan07
For Beginners: What Is a BOM? How BOM Works with ECO, ECN, and ECR in Electronics Manufacturing
For many people who are new to the electronics manufacturing and assembly industry, BOM and ECO are two very important terms—but also two of the most confusing ones. In this article, I’ll try to explain these concepts in a simple … Continue reading
Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading
