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Category Archives: Process
Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test
Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading
Aug12
BGA Solder Ball Crack Analysis Using the Red Dye Test | Types and Failure Patterns
Figure: Use the Red Dye Test to Identify BGA Solder Ball Cracks: Failure Patterns and Practical Analysis BGA IC functional failures are a major headache for many electronics companies. This is especially true today, as most CPUs use BGA packages. … Continue reading
Jul08
BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects
Figcaption：BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects This article is intended for anyone who isn’t yet familiar with how to evaluate the quality of BGA solder joints from cross-section images. Workingbear happens to have … Continue reading
May13
MRB Decision-Making and Cosmetic Quality Evaluation for Plastic Parts
When Workingbear first joined an electronics final assembly factory as a product/process engineer, I often had to attend MRB (Material Review Board) meetings. From time to time, people would come to me asking me to evaluate rejected parts and decide … Continue reading
Apr27
Using Limit Golden Samples to Manage Non-Quantifiable Quality Standards
In business transactions, both buyers and sellers usually agree on a product specification and acceptance criteria for the items being purchased. These criteria may include things like full functionality, dimensions within tolerance, intact packaging, and no defects in color or … Continue reading
