Category Archives: Process

Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX

This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading

What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

The “SMT dispensing” process,  also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB).  The term “SMT Red Glue” … Continue reading

5 Key PCB Layout Considerations for Efficient Circuit Board Assembly and Soldering Production Processes

When designing a PCB layout, various questions inevitably arise. Is this PCB best suited for a single-layer, double-layer, or multi-layer configuration? How should you protect against ESD/EMI? Will the printed circuit board assembly (PCBA) use a single-sided or double-sided process? … Continue reading

Do PCB Designs Require Reserving Board Edges and Grooves for Routers De-Paneling Machines?

A while back, a netizen asked how the Router de-panel machine cuts PCB panels and whether there’s a need to reserve board edges (break-away) for the Router machine in PCB design. Upon careful consideration, I thought my previous answer might … Continue reading

PCB Board Edge Removal and Panelization: Pros and Cons of Router Panel Cutting

There are several methods to cut and separate pre-panelized PCBs into individual boards, and one commonly adopted approach for thin and finely dimensioned mobile phone PCBs is using a Router Cutting Machine. It offers numerous advantages over V-Cut scoring machines, … Continue reading