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Category Archives: Process
Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading
Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test
Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading
Aug12
BGA Solder Ball Crack Analysis Using the Red Dye Test | Types and Failure Patterns
Figure: Use the Red Dye Test to Identify BGA Solder Ball Cracks: Failure Patterns and Practical Analysis BGA IC functional failures are a major headache for many electronics companies. This is especially true today, as most CPUs use BGA packages. … Continue reading
Jul08
BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects
Figcaption:BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects This article is intended for anyone who isn’t yet familiar with how to evaluate the quality of BGA solder joints from cross-section images. Workingbear happens to have … Continue reading
May13
MRB Decision-Making and Cosmetic Quality Evaluation for Plastic Parts
When Workingbear first joined an electronics final assembly factory as a product/process engineer, I often had to attend MRB (Material Review Board) meetings. From time to time, people would come to me asking me to evaluate rejected parts and decide … Continue reading