Category Archives: Process


Jan07
For Beginners: What Is a BOM? How BOM Works with ECO, ECN, and ECR in Electronics Manufacturing

For many people who are new to the electronics manufacturing and assembly industry, BOM and ECO are two very important terms—but also two of the most confusing ones. In this article, I’ll try to explain these concepts in a simple … Continue reading →

Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly

TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading →

Dec03
PCB Edge Removal and De-paneling Methods: A Complete Overview

When making printed circuit boards (PCBs), individual boards are first combined into a big panel board. After components mounting or soldering, they are separated into individual boards using de-paneling tools. This article summarizes the three most common PCB de-paneling methods … Continue reading →

Nov13
PCB Edge Removal and De-paneling: Stamp Hole Design

In most PCB (Printed Circuit Board) designs, panels are usually connected using V-cuts or tabs/ribs, and then separated with a V-cut scoring machine or a router de-panel machine. However, besides these two common connection methods, there’s another approach called the … Continue reading →

Nov06
PCB Edge Removal and De-paneling: Precautions for Manual Breaking

There are many ways to de-panel or remove the edge rails of a PCB, but the simplest and cheapest method is manual V-cut breaking. However, this method can easily lead to uncontrolled quality issues. Before using manual breaking, it’s important … Continue reading →