The Printed Circuit Board Assembly (PCBA) is a very popular technology in modem industry. For example, the cell phone, computer, Television, remote toy car, etc. all have the PCBA module inside. The invention of PCBA technology is really help the products development trend to small and tiny size.
Do you know how EMS (Electronic Manufacturing Services) fabricate a PCBA?
- How EMS fabricate a PCB assembly?
- How to print solder paste on PC Board and screen printing notices?
- How to Determine Whether Underfill is Needed for BGA?
Why BGA soldering ball always crack?
“Stress > Bonding-force”
is the root cause of electronic components drop from the PCB and solder crack.
- Why BGA soldering ball always crack(1)? Stress > bonding-force
- Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
- Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
- Why BGA soldering ball always crack(4)? Using “copper” base material as the surface finish for PCB
- Why BGA soldering ball always crack(5)? Increase the contact area of solder to increase its strength
- Why BGA soldering ball always crack(6)? The recommendation of BGA pad design from Workingbear
- Why BGA soldering ball always crack(7)? The Bonding force between solder pad of copper foil and PCB substrate
- Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending
- Why BGA soldering ball always crack(9)? Increase the resistance of components to stress
- Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change
- Why BGA soldering ball always crack(11)? Stress is the Biggest Culprit in Causing BGA Solder Joint Cracks
- Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress
- Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
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