Category Archives: Quality
Nov11
OSP vs. ENIG: Which PCB Surface Finish Provides Stronger BGA Solder Joints?
Figure: OSP vs. ENIG: Which PCB Surface Finish Provides Stronger BGA Solder Joints? This article uses experimental data to demonstrate that solder joints on OSP-finished PCBs can have higher strength than those on ENIG-finished PCBs. The results also confirm that … Continue reading
Oct28
A Collection of Articles on Component Detachment and BGA Solder Joint Cracking
Figure: BGA solder joint craking: causes, analysis & reliability solutions. BGA solder joint cracking is one of the most challenging issues I’ve encountered throughout my career in electronics manufacturing. It’s also one of the topics that comes up most often … Continue reading
Oct21
Can Increasing Solder Paste Volume Improve BGA Soldering Defects Such as HIP?
X-ray image of a BGA showing more solder on the outer rows than on the inner rows. Improving BGA solder joint quality is an ongoing goal for SMT engineers, especially when working with fine-pitch BGA components. In general, BGAs with … Continue reading
Oct14
How to Strengthen BGA Solder Joints Through Design to Prevent Cracking
Figcaption: How to Strengthen BGA Solder Joints Through Design to Prevent Cracking Recently, several colleagues have asked me the same question: How can we improve BGA design to strengthen solder joints and prevent BGA solder ball cracking? The question came … Continue reading
Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading
