Category Archives: Quality


Jan16
RSS or RTS? Which SMT Profile Should You Choose?

post on January 16, 2024

Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (3,714)     comment (0)
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Jan09
HIP (Head-in-Pillow) Defect Phenomenon: Possible Causes in SMT Reflow Process

post on January 9, 2024

The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA … Continue reading →

Quality, SMT, Soldering     WorkingBear    Views (2,068)     comment (0)
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Jan02
SMT Reflow Soldering Temperature Profiles Explanation and Precautions

post on January 2, 2024

The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (7,259)     comment (0)
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Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?

post on July 27, 2023

WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (2,338)     comment (0)
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Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End

post on July 11, 2023

Many colleagues in the company have been asking WorkingBear recently for advice on designing  BGA (Ball Grid Array) to prevent solder cracking and enhance its strength. This request comes after a senior expressed concerns during a new product development meeting, … Continue reading →

Design, Glue/adhesive/epoxy/underfill,, Quality, SMT, Soldering     WorkingBear    Views (1,509)     comment (0)
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