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Category Archives: Quality
Apr02
Root Cause Analysis: Why FPC Traces Break
Recently, my company started seeing an increase in field returns caused by open circuits in flexible printed circuits (FPCs) inside the terminal. After digging into several cases, the root cause turned out to be broken copper traces. So what’s going … Continue reading
Feb10
Waiver, Concession & Deviation in Electronics Manufacturing: Engineer’s Guide to Risk Checks & Self-Protection
Caption: Every time I’m asked to sign a waive/concession approval, I can’t help but feel uneasy. (Boss asks you to approve a concession? How engineers protect themselves from taking the blame.) Have you ever been in this situation? It’s late … Continue reading
Jan14
Explaining the Relationship Between BOM, AML, AVL, and MPN
BOMs, AML/AVL, and MPNs are essentially the “recipe” behind electronics manufacturing. All of these terms are closely related to a product’s material list. Understanding what they mean is not difficult—the real challenge is knowing how to apply them effectively to … Continue reading
Jan07
For Beginners: What Is a BOM? How BOM Works with ECO, ECN, and ECR in Electronics Manufacturing
For many people who are new to the electronics manufacturing and assembly industry, BOM and ECO are two very important terms—but also two of the most confusing ones. In this article, I’ll try to explain these concepts in a simple … Continue reading
Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading
