Category Archives: Quality

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May27
Improve BGA solderability by partial increase solder paste volume

How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading

May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

Recently we met a DDR memory BGA (Ball Grid Array) soldering fail issue. Actually the is HIP (Head-In-Pillow) that two balls under the BGA package. We sent a people to field to check how customer do the operation and found … Continue reading

May01
How come the screw boss crack after mold-in screw insert?

Actually this is long ago issue and WorkingBear write down this article just for a record. One day we received a complaint from field and complained our product had plastic house broken issue. Actually this crack can be saw from … Continue reading

Apr24
How to select a good actuator design for right angle connector?

As my personal feeling that Right-angle FPC ZIF connector is really more easily to use than Drawer type of ZIF connector. Even right-angle connector is good but do you know how to select a good design of this kind of … Continue reading

Apr23
How many dimple need to be used for keypad metal dome?

Last article I mentioned that my company applied the metal dome without dimple as keypad contact solution just like the cell phone but we had trouble and met keypad press insensitive  issue. Now we solved the problem by adding the … Continue reading

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