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Category Archives: Quality
Sep05
Using 2D X-Ray to Diagnose BGA Solder Void Issues
This is an X-ray inspection image of an MCU’s BGA soldering that failed after reflow. The owner mentioned that the BGA package was not functioning, but when pressing on the MCU, it would temporarily work again. Since Workingbear didn’t have … Continue reading
Aug29
How to Use 2D X-Ray to Identify BGA Issues like Non-Wetting, Cold Solder, and HIP or NWO
If you’re an SMT engineer, you’ve probably used an X-Ray inspection machine to check the soldering quality of BGAs. But, after looking at the BGA solder balls repeatedly, they all seem to look the same. So, how can you tell … Continue reading
Aug22
What is ENIG Surface Finished for Circuit Boards? What Are Its Advantages and Disadvantages?
ENIG (Electroless Nickel Immersion Gold), also known as immersion gold (Au), chemical Ni/Au, or soft gold, is a type of surface finished for printed circuit boards (PCBs). It is widely used in the assembly of mobile phone circuit boards and … Continue reading
Aug15
Causes of Poor Solderability on HASL Finished PCBs (Data Collection and Analysis)
Workingbear personally doesn’t recommend using HASL (Hot Air Solder Leveling) surface-finished PCBs in today’s SMT reflow processes, especially for double-sided reflow or fine-pitch components located on 2nd side. The defect rate of soldering with HASL is quite high and hard … Continue reading
Aug01
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures
In recent years, the commercial application of 3D CT X-Ray has become increasingly noteworthy. As the technology matures, more companies are investing in its development, making the equipment more affordable, though still not quite at a consumer-friendly price point. Additionally, … Continue reading
