Category Archives: Quality


Jun03
TQRDCE Performance Expectations and Review

This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The strategy of company for establishing and maintaining long-term working relationships is through creating and monitoring mutual performance expect ions and measurements. Performance metrics, constructive feedback, as … Continue reading

May27
Improve BGA solderability by partial increase solder paste volume

How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading

May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

Recently we met a DDR memory BGA (Ball Grid Array) soldering fail issue. Actually the is HIP (Head-In-Pillow) that two balls under the BGA package. We sent a people to field to check how customer do the operation and found … Continue reading

May01
How come the screw boss crack after mold-in screw insert?

Actually this is long ago issue and WorkingBear write down this article just for a record. One day we received a complaint from field and complained our product had plastic house broken issue. Actually this crack can be saw from … Continue reading

Apr24
How to select a good actuator design for right angle connector?

As my personal feeling that Right-angle FPC ZIF connector is really more easily to use than Drawer type of ZIF connector. Even right-angle connector is good but do you know how to select a good design of this kind of … Continue reading