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Category Archives: Quality
Jun10
PCB rework: Selective solder mask removal by laser
As an engineer in the electronics manufacturing industry, have you ever encountered the need to rework a printed circuit board (PCB) to remove the solder mask? If so, how did you approach this problem? Traditionally, the solder mask is manually … Continue reading
Jun03
TQRDCE Performance Expectations and Review
This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and … Continue reading
May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume
Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading
May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?
We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading
May01
Why Do Screw Bosses Crack After Mold-In Screw Inserts? Common Causes and Solutions
This story is long-standing memory, but WorkingBear is documenting it here for reference and as a learning record. One day, we received a customer complaint regarding a product with a plastic housing that had cracked. The issue was visually striking, … Continue reading