Category Archives: Quality


Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

post on April 21, 2023

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading →

Manufacture, Moisture Sensitive, Process, Quality, SMT     WorkingBear    Views (8,178)     comment (0)

Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly

post on April 18, 2023

“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability. Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (9,284)     comment (0)
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Apr13
Red Dye Penetration Test to check for BGA solder joint cracking

post on April 13, 2023

Figure: Using the Red Dye Penetration Test to Detect Cracked BGA Solder Joints The Red Dye Penetration Test also known as Red Dye test or Dye and Pry test, is a technique used to inspect for surface-mount technology (SMT) defects such … Continue reading →

Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (12,439)     comment (0)
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Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources

post on April 11, 2023

Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading →

Design, PCB/FPC/PTF, Quality, SMT, Soldering     WorkingBear    Views (8,785)     comments (3)
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Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?

post on July 22, 2021

Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (11,319)     comments (1)
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