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Category Archives: Quality
Apr13
Red Dye Penetration Test to check for BGA solder joint cracking
Figure: Using the Red Dye Penetration Test to Detect Cracked BGA Solder Joints The Red Dye Penetration Test also known as Red Dye test or Dye and Pry test, is a technique used to inspect for surface-mount technology (SMT) defects such … Continue reading
Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading
Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading
Dec05
Both solder joint bridging and open solder joint happen at same BGA?
Is that possible for both solder joint bridging and open solder joint defect occur in the same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is rare to observe both solder joint bridging and open solder joint … Continue reading
Jun19
Will Increasing Solder Paste Volume Help Prevent MLCC Cracking?
Figure: Will Increasing Solder Paste Volume Help Prevent MLCC Cracking? Recently, Workingbear received a complaint from R&D asking us to increase the solder paste volume on the MLCC (Multilayer Ceramic Capacitor) component pads to improve a capacitor cracking issue. R&D … Continue reading
