Monthly Archives: August 2026

Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement

post on August 25, 2026

Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading →

Case study, Design, Quality, Reliability     WorkingBear    Views (351)     comment (0)
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Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test

post on August 19, 2026

Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye  Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (400)     comment (0)
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Aug12
BGA Solder Ball Crack Analysis Using the Red Dye Test | Types and Failure Patterns

post on August 12, 2026

Figure: Use the Red Dye Test to Identify BGA Solder Ball Cracks: Failure Patterns and Practical Analysis BGA IC functional failures are a major headache for many electronics companies. This is especially true today, as most CPUs use BGA packages. … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (661)     comment (0)
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