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Monthly Archives: August 2023
Aug31
Why is Panelization and Break-away Tab Necessary in PCB Manufacturing, then De-paneling after PCBA is Completed?
Why is “Panelization” performed during PCB manufacturing? And after surface mounting (SMT) assembly and wave soldering, why is it necessary to go through the additional process of “de-paneling” to separate the individual boards? What is the purpose of the PCB’s … Continue reading
Aug17
An Option for Adding More Solder – Solder Preforms
“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading
Aug08
What difference between SMT (Surface Mount Technology) and SMD (Surface Mount Device)?
What are SMT and SMD? The difference between SMT and SMD is that SMD (Surface Mount Device) refers to an electronic component mounted on a PCB using SMT (Surface Mount Technology). What do we mean by “SMT (Surface Mount Technology)” … Continue reading
Aug01
What is OSP (Organic Solderability Preservative) Surface Treatment for PCB? What are its Pros and Cons?
OSP (Organic Solderability Preservative) is a special chemical coating applied to the surface of copper on a PCB (Printed Circuit Board). This coating forms a thin protective film that keeps the bare copper from rusting or corroding when it’s stored. … Continue reading