Monthly Archives: February 2024

Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?

post on February 27, 2024

In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (8,845)     comment (0)
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Feb20
What is IMC (Intermetallic Compound)? How does IMC relate to PCB solder joint strength? Are there IPC standards for IMC thickness?

post on February 20, 2024

In the assembly and soldering process of printed circuit boards (PCBs), we often hear engineers or lab reports mentioning the term “IMC.” But what exactly is IMC? What role does IMC play in the PCB assembly (PCBA) soldering process? Does … Continue reading →

Soldering     WorkingBear    Views (16,621)     comment (0)
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Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions

post on February 15, 2024

Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (7,205)     comment (0)
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Feb06
Purpose of Using Lead-Free Low-Temperature Solder (LTS) SnBi, SnBiAg in Soldering

post on February 6, 2024

The alloy composition of lead-free LTS (Low Temperature Solder) usually includes the metal “bismuth (Bi)” in addition to tin (Sn) to lower its eutectic point. The commonly used lead-free solder SAC305 has a melting point of 217°C, while Sn64Bi35Ag1 has … Continue reading →

Quality, Reliability, SMT, Soldering     WorkingBear    Views (5,454)     comment (0)
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