Monthly Archives: March 2025

Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?

post on March 27, 2025

Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading →

Design, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (3,392)     comment (0)
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Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons

post on March 21, 2025

In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading →

Process, Quality, Reliability, Test/Inspection     WorkingBear    Views (3,788)     comment (0)

Mar20
What is Tg (Glass Transition Temperature) and Its Role in PCBs?

post on March 20, 2025

Glass Transition Temperature (Tg) is one of the most important properties of all plastic and epoxy resin materials. In fact, the Tg value is also an indicator of the quality of the fiberglass fabric used in PCB manufacturing. However, compared … Continue reading →

Fundamental Science, PCB/FPC/PTF, Plastic     WorkingBear    Views (6,634)     comment (0)

Mar13
What is CTE (Coefficient of Thermal Expansion)? What is α2-CTE? How Does CTE Affect PCB Quality?

post on March 13, 2025

CTE (Coefficient of Thermal Expansion) refers to how a material’s geometric properties change as its temperature rises or falls due to thermal expansion and contraction. In practical applications, CTE is divided into two main categories: Coefficient of Linear Thermal Expansion … Continue reading →

Fundamental Science, PCB/FPC/PTF     WorkingBear    Views (6,195)     comment (0)
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Mar06
What is the Popcorn Effect in PCBs and Electronic Components?

post on March 6, 2025

The Popcorn Effect, also known as blistering, is a phenomenon in PCBs and electronic components in which demamination or internal bubbles can form when the material is exposed to high temperatures during soldering. The phenomenon is similar to popcorn popping and … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, Reliability     WorkingBear    Views (6,049)     comment (0)
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