Monthly Archives: September 2026

Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause

post on September 16, 2026

Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading →

Design, EDX/EDS/SEM/IMC/FTIR, PCB/FPC/PTF, Process, Quality, Reliability, Soldering     WorkingBear    Views (222)     comment (0)
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Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them

post on September 9, 2026

Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading →

Quality, Reliability, Soldering     WorkingBear    Views (276)     comment (0)
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Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids

post on September 2, 2026

Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading →

Quality, Reliability, Soldering     WorkingBear    Views (225)     comment (0)
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