Monthly Archives: February 2023

Feb22
Why BGA soldering ball always crack(5)? Increase the contact area of solder to increase its strength

post on February 22, 2023

In the previous article, we talked about “How to Increase the bonding force for PCBA by using “Copper” base as the PCB surface finish“. Today, we will discuss further how the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) … Continue reading →

Design, SMT, Soldering     WorkingBear    Views (5,221)     comment (0)
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Feb15
Why BGA soldering ball always crack(4)? Using "copper" base material as the surface finish for PCB

post on February 15, 2023

Following last discussion, we learned that solder cracking is caused when the stress placed upon it exceeds the strength of the bonding force. However, it’s possible to address this issue by increasing the bonding force of the printed circuit board … Continue reading →

Design, SMT, Soldering     WorkingBear    Views (3,978)     comment (0)
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