Monthly Archives: October 2024

Oct31
The Limitations of Using “Mirrored Panels” or “Flipped Panels” in SMT

post on October 31, 2024

We all know that when producing PCBs and PCBAs, multiple individual PCBs are usually combined into one larger panel, a process called panelization, to improve production efficiency. Typically, these individual boards are arranged in a neat and consistent manner with … Continue reading →

PCB/FPC/PTF, Process, SMT     WorkingBear    Views (3,601)     comment (0)

Oct24
Causes and Prevention of PCB Warping and Bending After Reflow

post on October 24, 2024

A reader recently asked: “In surface mount assembly, PCBs often warp or bend after going through the reflow process, which can cause issues like open solder joints or tombstoning. How can we overcome this?” To be honest, the reasons behind … Continue reading →

PCB/FPC/PTF, Quality, SMT     WorkingBear    Views (6,113)     comment (0)

Oct17
Benefits and Drawbacks of Using Nitrogen (N2) in SMT Reflow Ovens: Optimizing Soldering Quality and Reducing Oxidation

post on October 17, 2024

The primary purpose of adding Nitrogen (N2) to the SMT reflow oven is to reduce oxidation on the soldering surface and improve the wettability of the solder joints. Nitrogen is a colorless, odorless, and chemically inactive gas. It belongs to … Continue reading →

Quality, SMT, Soldering     WorkingBear    Views (8,031)     comment (0)
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Oct03
What Causes Wave-Like Wrinkles or Cracks in Solder Joints After Reflow?

post on October 3, 2024

These soldering wrinkles appeared quite a while ago, but Workingbear recently came across a similar situation on an online forum. Thinking others might encounter the same issue, I decided to document it for both personal reference and to share with … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (4,992)     comment (0)
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