Monthly Archives: April 2023


Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials

post on April 28, 2023

The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has … Continue reading →

Design, PCB/FPC/PTF     WorkingBear    Views (3,798)     comment (0)
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Apr25
Four Solutions for Quickly Removing labels from Carton and Devices

post on April 25, 2023

At Workbearing’s electronic manufacturing service (EMS) factory and warehouse, products often need to be reworked for various reasons, such as customer requests or converting products for inventory purposes. While removing labels is not the most crucial task in the rework … Continue reading →

Process     WorkingBear    Views (4,263)     comment (0)
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Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

post on April 21, 2023

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading →

Manufacture, Moisture Sensitive, Process, Quality, SMT     WorkingBear    Views (8,162)     comment (0)

Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly

post on April 18, 2023

“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability. Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (9,270)     comment (0)
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Apr13
Red Dye Penetration Test to check for BGA solder joint cracking

post on April 13, 2023

Figure: Using the Red Dye Penetration Test to Detect Cracked BGA Solder Joints The Red Dye Penetration Test also known as Red Dye test or Dye and Pry test, is a technique used to inspect for surface-mount technology (SMT) defects such … Continue reading →

Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (12,428)     comment (0)
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