Monthly Archives: April 2023


Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources

post on April 11, 2023

Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading →

Design, PCB/FPC/PTF, Quality, SMT, Soldering     WorkingBear    Views (8,776)     comments (3)
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Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress

post on April 6, 2023

Manufacturing processes that may result in high stress in factories Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (3,544)     comment (0)
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