Monthly Archives: December 2018

Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？

post on December 19, 2018

What is the IMC, the Intermetallic Compound? We always heard the manufacturing engineer or some of Mechanical Engineer and EE talking about this keyword when discussing soldering quality or electronic component drop issue. So, what is the role of IMC … Continue reading →

Process, Soldering     WorkingBear    Views (48,448)     comments (3)
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Dec05
Both solder joint bridging and open solder joint happen at same BGA?

post on December 5, 2018

Is that possible for both solder joint bridging and open solder joint defect occur in the same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is rare to observe both solder joint bridging and open solder joint … Continue reading →

Process, Quality, Soldering     WorkingBear    Views (9,865)     comment (0)
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