Monthly Archives: November 2023

Nov28
When does SMT require Reflow Carriers and Full Process Carriers?

post on November 28, 2023

What is an SMT Reflow Carrier? Why is it sometimes necessary in SMT production? And when do we need an SMT Full Process Carrier? Are there situations where neither is required? The so-called “SMT reflow carriers or reflow templates” are … Continue reading →

SMT, Soldering     WorkingBear    Views (5,403)     comment (0)
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Nov21
Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX

post on November 21, 2023

This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading →

Process, SMT     WorkingBear    Views (6,601)     comment (0)
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Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

post on November 16, 2023

The “SMT dispensing” process,  also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB).  The term “SMT Red Glue” … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Soldering     WorkingBear    Views (6,705)     comment (0)

Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH

post on November 2, 2023

The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading →

SMT, Soldering     WorkingBear    Views (13,284)     comment (0)