Monthly Archives: January 2024
Jan30
8D Report: Problem Analysis and Solving
The “8D report” is a tool commonly used in the electronics assembly industry for “problem analysis and solving.” Due to its systematic and clear steps, the “8D report” is often utilized in responding to customer complaint cases. The term “8D” … Continue reading
Jan23
Why a BOM (Bill of Materials) is Critical in Electronic Product Development
A Bill of Materials (BOM) is a list of materials required for the production of an electronic product. It serves as an important bridge between the designer, manufacturer, and supplier. The BOM includes all the components, devices, and materials used … Continue reading
Jan16
RSS or RTS? Which SMT Profile Should You Choose?
Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading
Jan09
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow
Figure: What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). … Continue reading
Jan02
SMT Reflow Soldering Temperature Profiles Explanation and Precautions
The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading
