Monthly Archives: April 2025

Apr30
Understanding the EDX Report: Can EDX Be Used to Estimate a Sample’s Chemical Formula?

post on April 30, 2025

Workingbear has noticed that many people still have questions about EDX/EDS elemental analysis reports. This is the second article where he tries to provide answers based on his knowledge. EDX (Energy-Dispersive X-ray Spectroscopy), also known as EDS, is actually an … Continue reading →

EDX/EDS/SEM/IMC/FTIR     WorkingBear    Views (4,962)     comment (0)

Apr23
Understanding the EDX Report: Why Does the Same Element Have Multiple Peaks?

post on April 23, 2025

In failure analysis reports for PCB assembly defects, we often use EDX or call EDS (Energy-Dispersive X-ray spectroscopy) for chemical elemental analysis. However, many people don’t fully understand how EDX works, and they have only a vague idea of how to … Continue reading →

EDX/EDS/SEM/IMC/FTIR     WorkingBear    Views (8,984)     comment (0)

Apr17
How to Identify Unknown Contaminants: Choosing Between EDX/EDS and FTIR

post on April 17, 2025

When we discover unknown contaminants on printed circuit boards assembly (PCBA) or electronic products, how do we determine what they are and where they come from? Do we rely on experience, or do we use scientific instruments for analysis? What … Continue reading →

EDX/EDS/SEM/IMC/FTIR, Quality     WorkingBear    Views (5,834)     comment (0)
,

Apr10
What is PCB (Printed Circuit Board)? What Are Rigid, Flexible, and Rigid-Flex PCBs?

post on April 10, 2025

In the electronic devices we use daily—such as remote controls, smartphones, refrigerators, TVs, air conditioners, and computers—there is a crucial component called the Printed Circuit Board (PCB). The name comes from the way its electrical circuits are formed, similar to … Continue reading →

PCB/FPC/PTF, Product Introduction     WorkingBear    Views (3,627)     comment (0)

Apr03
PCB Warping and Bowing: Causes, Prevention, and Best Design PracticesPCB warpage

post on April 3, 2025

A user asked: “During the SMT process, PCBs often warp or bow after going through reflow high temperature. In severe cases, this can lead to defects like insufficient solder joints or tombstoning. How can we prevent and solve this issue?” … Continue reading →

PCB/FPC/PTF, Quality, SMT     WorkingBear    Views (3,436)     comment (0)