Monthly Archives: September 2019

Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force

post on September 25, 2019

What is the actual root cause of  BGA solder ball cracking? Stress is higher than its bonding-forces. The root cause of BGA solder ball cracked is stress higher than bonding-forces. Stress is higher than bonding-force is the certain result of … Continue reading →

Design, SMT, Soldering     WorkingBear    Views (13,986)     comment (0)
,