Category Archives: Quality


Jun13
How to Determine Whether Underfill is Needed for BGA?

post on June 13, 2023

A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (7,341)     comment (0)
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Jun06
Questions from Newcomer: Why is Solder Paste Needed for SMT Reflow since BGA Already has Solder Balls? Is Solder Paste Needed for BGA Repair?

post on June 6, 2023

Questions from a newcomer about electronic manufacturing assembly process: Since there are already solder balls locate on the BGA substrate, why is it necessary to apply solder paste on the PCB pads during SMT reflow? Is it necessary to apply … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (4,190)     comment (0)
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May30
The Hidden Dangers of Using Overdue PCBs: Can Baking Salvage Them?

post on May 30, 2023

All materials actually have its shelf-life, some shorter and some longer than others. So what happens when expired materials are used? Think about what will happens when you eat expired food. What about using expired Printed Circuit Boards (PCBs)?

PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (4,550)     comment (0)

May18
Clarifying the Concept of Electronic Component Soldering Strength

post on May 18, 2023

While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading →

Connector, Quality, Reliability, SMT, Soldering     WorkingBear    Views (2,893)     comment (0)
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May10
How to Bake PCB? Baking Conditions and Methods, Why Expired PCBs Need to Be Baked Before SMT or Reflow Soldering?

post on May 10, 2023

For many engineers, they may not understand why PCBs must be baked before going through the SMT reflow oven if they have expired their storage shelf life. Or perhaps, they believe that PCBs should be baked regardless of whether or … Continue reading →

PCB/FPC/PTF, Process, Quality     WorkingBear    Views (10,800)     comment (0)
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