Category Archives: Soldering

Process Impact of Substituting SMD Parts with Paste-In-Hole Parts

Today, one question from my boss, “Is there any difference or influence on the process and design if we like to convert the SMD parts to DIP type and go through the PIH(Paste-In-Hole) process?” Later, I realized that the question … Continue reading

Solder Preforms – Another Choice for Solder Volume Increasing Solution

Today, most of electronic parts are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading

What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

Today, the SMD parts become smaller and smaller. Their sizes can be developed to 0402, 0201, and even 01005 (Note 1). Moreover, the pitch between the pins of a common IC (integrated circuit) is shorten to fine pitch of 0.5mm, … Continue reading

Cooper Defined vs. Solder Mask Defined pad design for BGA soldering strength

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading

Why thinner PCB will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear always find there is tug of war between Designer, Marketing and Manufacturer. The Marketing always like the design be thin, sleek, and modern looking. The designer always think fabrication is easy. The … Continue reading