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Category Archives: Soldering
Jul25
Effects of Nitrogen (N2) in SMT Reflow on Various Soldering Defects
“Oxidation” is a major enemy of solder quality, but oxidation is a natural law of elements striving for stability that cannot be avoided. Using nitrogen (N2) to isolate solder from oxygen (O2) is one of the few effective methods currently … Continue reading
Jun20
The Benefits of Using SMT Synthetic Stone or Aluminum Alloy for Reflow Carriers
With the advancement of technology, electronic products are becoming thinner and more compact. Consequently, electronic components are also getting smaller, and even the thickness of printed circuit boards (PCBs) is decreasing. The thinnest PCB Workingbear has seen is 0.4mm. Such … Continue reading
May23
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
Apr25
How are decisions made regarding stencil thickness, aperture, and shape? How can solder beads be prevented?
A user asked: “How is the thickness of the stencil determined? What considerations are there for the shape of the stencil apertures?” The thickness of the stencil is mainly determined by the amount of solder paste needed for component soldering. … Continue reading
