Jun03
TQRDCE Performance Expectations and Review

post on June 3, 2015

This is an example that implement TRQDCE form for vendor survey.


TQRDCE Introduction:

TQRDCE ChecklistThe company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and prompt corrective action by both the supplier and customer is essential for achieving continuous process improvement.

To enable customers to measure our suppliers, we have developed the TQRDCE (Technology, Quality, Responsiveness, Delivery, Cost, and Environmental) review. It is crucial for suppliers to maintain a competitive advantage by providing materials of the highest quality and lowest total cost, with the best delivery, responsiveness, and technology available. The TQRDCE review is a tool that measures and communicates a supplier’s performance, and assists the company in determining their position in future business relationships.

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Manufacture, Quality     WorkingBear    Views (25,188)     comment (0)

May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

post on May 27, 2015

BGA_X-Ray_pictureImproving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, inspecting the soldering result is challenging because the solder joints are hidden under the BGA body, and sometimes even 2D X-Ray inspection is insufficient. (5DX or angle rotation X-Ray might be able to inspect BGA soldering quality, but these methods are expensive.)

Experience tells us that most BGA solderability failures are caused by the HIP (Head-In-Pillow) or call HoP (Head-on-Pillow) soldering defect, and over 90% of HIP defects occur at the four corners of the BGA package. This is due to the longer diagonal distance and the greater impact from board warpage and BGA deformation. Many senior SMT engineers have conducted experiments and proven that increasing the solder paste volume on the pads under the BGA can reduce the risk of HIP defects.

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Design, Manufacture, Quality, Soldering     WorkingBear    Views (11,813)     comment (0)
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May20
Shipping carton drop/impact test condition

post on May 20, 2015

Do you know how vendor ensure that their products are not damaged during shipping due to handling by transporters or delivery personnel? Reputable vendors put effort into designing and selecting suitable packaging materials for shipping to ensure the quality of their products. This article will introduce how vendor test whether their cardboard packaging meets general shipping requirements.

The electronic industry grows quickly. Each vendor takes responsible to his own component only to make it good and low cost. Take a flashlight manufacturer as example. There are bulb, wires, switch, spring, and plastic or metal housing make up the flashlight. The manufacturer buys all the sub-components from each supplier and assembles them together to fabricate the flashlight then sell to end-user.

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Corrugated Paper, Design, Manufacture     WorkingBear    Views (4,757)     comment (0)
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May14
Temperature Environmental Cycle Profile

post on May 14, 2015

temperature cycle storage environmental test profile

The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain components and assemblies are sensitive to these temperature extremes and could be weakened due to induced stresses. Therefore, it is important that a logical sequence of testing be followed in order to observe these effects and assure the product’s performance under various temperature conditions and after temperature extremes have been applied.

(Note: This test didn’t include the humidity.)

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Design, Reliability     WorkingBear    Views (7,549)     comment (0)

May12
Humidity Temperature Cycle Profile

post on May 12, 2015

Humidity Temperature Cycle Profile

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in components, assemblies and process, which may appear in the field during normal service, while keeping test time at a minimum. Performance tests are made at various intervals of the test duration and each test must pass for the design to meet the requirements of this section.

Hygroscopic materials (e.g., printed circuit boards, molded plastics, sealed components, etc.) will absorb moisture proportional to the applied vapor pressure and time of application. Excessive moisture penetration may cause swelling of material or contamination actions, destroying functional ability as well as causing leakage paths between sensitive circuits, result when moisture reacts with trapped chemicals from construction processes causing corrosion or severe etching of metal surfaces. In some cases dendritic growth can cause short circuits or high voltage flashover between closely spaced traces or pin spacing. The following humidity test is designed to accelerate the occurrence of these failure mechanisms if they exist.

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Design, Reliability     WorkingBear    Views (9,699)     comment (0)