Tag Archives: RFI/EMI
| Subject Title | Views | Comments |
| Views (8,418) | (0) |
Popular Articles
- [67,982] PCB Assembly
- [48,956] What is IMC (Intermetallic Compound) in the e...
- [33,560] SMT Reflow Soldering Temperature Profiles Exp...
- [27,601] Copper Defined vs. Solder Mask Defined pad de...
- [25,764] Why Do Screw Bosses Crack After Mold-In Screw...
- [25,329] TQRDCE Performance Expectations and Review
- [19,869] Why Do BGA Solder Balls Keep Cracking (3)? IM...
- [19,779] What is Step-up & Step-down Stencil? Selectiv...
- [17,305] What is IMC (Intermetallic Compound)? How doe...
- [17,039] Why do thinner PCBs will need carrier for ref...
-
Recent Posts
- A Collection of Articles on Component Detachment and BGA Solder Joint Cracking
- Can Increasing Solder Paste Volume Improve BGA Soldering Defects Such as HIP?
- How to Strengthen BGA Solder Joints Through Design to Prevent Cracking
- What Is HASL Surface Finish? Advantages and Disadvantages
- Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Recent Comments
- WorkingBear on Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions
- Frank Shum on Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions
- WorkingBear on How We Solved the Keypad Sensitivity Issue by Switching to a 3-Dimple Metal Dome Design
- mauricio on How We Solved the Keypad Sensitivity Issue by Switching to a 3-Dimple Metal Dome Design
- Bob U. on What is Wave Soldering? Laminar Wave and Turbulent Wave Purpose
- enrico on Customer Complaint About Oil Contamination on PCB: Who’s the Real Culprit? (FTIR Analysis)
- Enrico on The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
- WorkingBear on Why Do BGA Solder Balls Keep Cracking (13)? Usage Environment is the Biggest Challenge of Stress Sources
- boris on Why Do BGA Solder Balls Keep Cracking (13)? Usage Environment is the Biggest Challenge of Stress Sources
- Jason Wong on What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
Tag Cloud
Baking BGA CAF Component drop/detachment Concept Contamination Cpk DFx Discoloration ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH PLC Problem analysis & solving Red Dye Penetration Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-rayCategories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Statcounter
Histats
Bookmarks
Technical Series
