TQRDCE Performance Expectations and Review

This is an example that implement TRQDCE form for vendor survey.

TQRDCE Introduction:

TQRDCE ChecklistThe strategy of company for establishing and maintaining long-term working relationships is through creating and monitoring mutual performance expect ions and measurements. Performance metrics, constructive feedback, as well as prompt corrective action by the supplier and by customer are fundamental to achieving continuous process improvement.

In order to provide customer with the means to measure our suppliers, the TQRDCE (Technology, Quality, Responsiveness, Delivery, Cost, and Environmental) review was developed. It is imperative that supplier maintain a competitive advantage by providing materials of the highest quality and lowest total cost, with the best delivery, responsiveness and technology available. The TQRDCE Review is a tool for measuring and communicating a supplier’s performance and to aid company in determining their place in future business relationships.

This review is being provided two weeks in advance of our scheduled meeting with [SUPPLIER] on [DATE] at [LOCATION]. it should be shared with the appropriate personnel at [SUPPLIER] with a focus on the development objectives. it is company’s expectation that [SUPPLIER] come to the review with a written action plan that addresses all the development objectives listed on the review.

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Improve BGA solderability by partial increase solder paste volume

BGA_X-Ray_pictureHow to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the PCB. Besides, it’s soldering quality is also hard to be inspected since its solder hide under its body and sometimes even can’t be inspected by 2D X-Ray inspector. (5Dx or angle rotation X-Ray maybe ok to inspect BGA soldering quality but expensive)

As experience tell us that most of BGA solderability fail is caused by the HIP (Head-In-Pillow) soldering defect and over 90% of the HIP defect show on four corners of BGA package. Because of the diagonal distance is longest and greatest impact from board warpage and BGA deformation. There are many senior SMT engineer had done some experiments and prove that Increasing the solder paste volume on the pads under BGA can reduce the HIP defect risk.

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Shipping carton drop/impact test condition

The electronic industry grows quickly. Each vendor takes responsible to his own component only to make it good and low cost. Take a flashlight manufacturer as example. There are bulb, wires, switch, spring, and plastic or metal housing make up the flashlight. The manufacturer buys all the sub-components from each supplier and assembles them together to fabricate the flashlight then sell to end-user.

All the sub-components are delivery by air, ocean, or truck to destination. It is important to prevent the delivery parts without damage during transferring. Most of the packaging uses corrugated paper carton and cardboard to hold inside components and prevent it from damage by falling or throwing down by porter or carrier.

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Temperature Environmental Cycle Profile

temperature cycle storage environmental test profile

The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain components and assemblies are sensitive to these temperature extremes and could be weakened due to induced stresses. Therefore, it is important that a logical sequence of testing be followed in order to observe these effects and assure the product’s performance under various temperature conditions and after temperature extremes have been applied.

(Note: This test didn’t include the humidity.)

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Humidity Temperature Cycle Profile

Humidity Temperature Cycle Profile

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in components, assemblies and process, which may appear in the field during normal service, while keeping test time at a minimum. Performance tests are made at various intervals of the test duration and each test must pass for the design to meet the requirements of this section.

Hygroscopic materials (e.g., printed circuit boards, molded plastics, sealed components, etc.) will absorb moisture proportional to the applied vapor pressure and time of application. Excessive moisture penetration may cause swelling of material or contamination actions, destroying functional ability as well as causing leakage paths between sensitive circuits, result when moisture reacts with trapped chemicals from construction processes causing corrosion or severe etching of metal surfaces. In some cases dendritic growth can cause short circuits or high voltage flashover between closely spaced traces or pin spacing. The following humidity test is designed to accelerate the occurrence of these failure mechanisms if they exist.

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