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Temperature Environmental Cycle Profile

temperature cycle storage environmental test profile

The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain components and assemblies are sensitive to these temperature extremes and could be weakened due to induced stresses. Therefore, it is important that a logical sequence of testing be followed in order to observe these effects and assure the product’s performance under various temperature conditions and after temperature extremes have been applied.

(Note: This test didn’t include the humidity.)

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Humidity Temperature Cycle Profile

Humidity Temperature Cycle Profile

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in components, assemblies and process, which may appear in the field during normal service, while keeping test time at a minimum. Performance tests are made at various intervals of the test duration and each test must pass for the design to meet the requirements of this section.

Hygroscopic materials (e.g., printed circuit boards, molded plastics, sealed components, etc.) will absorb moisture proportional to the applied vapor pressure and time of application. Excessive moisture penetration may cause swelling of material or contamination actions, destroying functional ability as well as causing leakage paths between sensitive circuits, result when moisture reacts with trapped chemicals from construction processes causing corrosion or severe etching of metal surfaces. In some cases dendritic growth can cause short circuits or high voltage flashover between closely spaced traces or pin spacing. The following humidity test is designed to accelerate the occurrence of these failure mechanisms if they exist.

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Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

Recently we met a DDR memory BGA (Ball Grid Array) soldering fail issue. Actually the is HIP (Head-In-Pillow) that two balls under the BGA package. We sent a people to field to check how customer do the operation and found the product can’t be powered on. The interesting is the product will be powered on once use finger to press the DDR memory component.

How come this happen? Production line said these products had implemented the power on B/I (Burn/In) for 12 hours at 40°C. Why we still see this kind of BGA soldering defect in field?

Before answer this question, we must understand how the HIP defect happen. The HIP is a solder joint defect where the solder paste deposit wets the pad, but does not fully wets the ball. It is usually caused by the deformation of PCB resin and BGA substrate during reflow high temperature. The deformation make the solder paste on pad and ball on BGA separately while solder become liquid phase. Once the parts start cooling and the deformation will gradually back to normal condition but the liquid solder also back to solid and make two balls as HIP.

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How come the screw boss crack after mold-in screw insert?

screw boss brokenActually this is long ago issue and WorkingBear write down this article just for a record.

One day we received a complaint from field and complained our product had plastic house broken issue. Actually this crack can be saw from outside of the plastic case. So the crack is really terrible.

As checked the defect plastic parts and found the crack all came from the screw boss from inside to outside of plastic house. There is a mold-in screw INSERT be installed inside the plastic boss. We think the potential cause shall come from the screw boss design and plastic inject condition.

Here WorkingBear will try to list out  the screw boss crack potential causes for your reference and also take a memo for myself:

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How to design LCM gasket/cushion for manufacture?

The gasket/cushion went outside of LCM

The LCM (LCD Module) is a common component for the electronic products. Almost of the LCM was made by glass and it is brittle and  break easily while hit or drop on the floor due to handle careless. As product design we will install a rubber gasket or cushion locate between the glass and plastic case or metal bezel to prevent it from squeezing due to press or careless hitting.

Although this kind of rubber gasket is a simple design but if the gasket didn’t design well then the installation will be a big challenge in manufacturer. We often see the gasket go outside of the display view area. If this is a touch panel product then it will result the touch function fail. If this kind of issue happens in filed then we will get big trouble.

Therefore, this article attempts to look for the rubber gasket design methods.

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