"Being Ready for Potential Layoffs" is the Best Strategy to Avoid Job Cuts

The Workingbear is used to seeing job cuts happen in global companies, especially those from the United States, whether they’re big or small. Normal downsizing is like the body’s “metabolism” – not necessarily a bad thing. Companies hire when there’s a lot of work, and they let people go when business isn’t doing well. It’s a routine occurrence. Even though I’ve grown accustomed to it, there’s always a touch of sadness when layoffs happen, especially when coworkers I’ve spent time with suddenly vanish from the company because they’ve been laid off.

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Another Option for Increasing Solder Volume in SMT – Solder Preforms

“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as electronic components continue to shrink in size.

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Understanding the Impact of Solder Paste and Flux Composition on Electronic Board Assembly Quality

Solder paste is a crucial material in the domain of modern electronic assembly technology. It is used for soldering electronic components onto printed circuit boards (PCBs), this enabling the creation of ever-evolving technological products.

The invention of solder paste played a pivotal role in the miniaturization of electronic product assembly technology. It transformed bulky devices, such as early large sized mobile phones, into pocket-sized, feature-rich smartphones.

The term “paste” in solder paste is used because its pre-melted form is similar in consistency to the toothpaste we use daily. Before soldering, the paste-like solder can be applied to hold electronic components in place on the surface of the PCB. This ensures that these components remain in position, even under slight vibrations. Its primary function, however, is to solder electronic components onto the PCB, facilitating the connectivity of electronic signals.

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Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement

Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement

In the realm of PCB assembly, the go-to technology in SMT (Surface Mount Technology) is what we call “Full Board Reflow Soldering.” While there are other methods for assembling PCBs, this “Full Board Reflow Soldering” can be divided into two flavors: “Single-Sided Board SMT Reflow” and “Double-Sided Board SMT Reflow.” These days, single-sided reflow seems to be taking a back seat because double-sided reflow lets us save precious space on the PCB, making our products more compact. That’s why you’ll find most boards in the market are crafted using the double-sided reflow technique.

(By the way, if space isn’t an issue, the single-sided board process could cut down one SMT cycle. When you weigh material costs against SMT labor costs, single-sided might just be the more cost-effective route.)

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How Preventing Heavy Components from Falling during Secondary time SMT Reflow

How Preventing Heavy Components from Falling during Secondary time Reflow

With the rapid advancement of mobile communication technology, EMS (Electronic Manufacturing Services) providers worldwide are facing severe labor shortages. Furthermore, the Industry 4.0 trend has heightened the demand for automation in EMS facilities. As a result, many components that were previously not suited for Surface Mount Technology (SMT) are now required to meet the Paste-In-Hole (PIH) process. These components include Type A USB connectors, RJ45 Ethernet connectors, power sockets, transformers, and other relatively bulky parts. In the past, these components were typically soldered after SMT using wave soldering equipment or manual touch-up.

Due to the scarcity of manual labor and the need to save on subsequent manufacturing costs, along with quality considerations, many system manufacturers and EMS companies are gradually transitioning these non-SMT components to at least meet the PIH process requirements. This enables all electronic components to be soldered to the printed circuit board through a reflow oven.

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